Monday, March 23, 2020

Getting the Voids Out

MACOM, March 23, 2020

Reducing solder voids is a pervasive challenge affecting the electronics industry.  With higher thermal dissipation requirements placed upon the attachment of a device to a circuit board the number of voids within the solder joint becomes critical.  There are various considerations that need to be taken into account, including 1) the design of the substrate 2) the surface condition of the part being attached 3) the type of solder selected 4) the reflow profile 5) pattern and volume of paste deposition, among others.  Let’s dive further into some of these considerations:

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